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Add on stencils to complete the pack for the RL-601T
etc actually plugged into the connector
63% Tin 37% Lead
Single stencil for Direct BGA eMMC / eMCP (221 153 169 254 162 186 ) for reballing BGA memory eMMC / EMCP chips found in phones and tablets
We have tried them and really like how they work compared to other solutions
iSocket iPhone 11/11Pro/11ProMax split board test jig diagnostics Add on stencils to completeThis is an essential tool for iPhone 11 series logic board work. After splitting the logic board, a top mainboard can be attached to a known good bottom board in this iSocket, and vice versa to allow for troubleshooting. The iSocket jig will create temporary connections between the two half boards without having to resolder the boards for testing.